According to information shared by Smart Pikachu on Weibo, the upcoming Huawei P70 series is set to feature a fresh chipset from HiSilicon, tentatively identified as the “Kirin 9010.” Although the official announcement of the chip is pending, it has been under development for an extended period.
The first mention of the Kirin 9010 surfaced approximately three years ago when a leakster disclosed its potential as a 3nm chip. Initially, TSMC appeared to be the likely manufacturing foundry, but given the existing trade restrictions on Huawei, this possibility seems less likely.
Recent findings revealed that Huawei shipped laptops with Kirin 9006C chips produced by TSMC. However, this was later clarified as existing stock. While SMIC manufactures 7nm chips akin to the Kirin 9000 series, its performance falls short of TSMC’s 5nm node. There are speculations that SMIC might be working on a 3nm node, although this development is expected to take several years.
The authenticity of the Kirin 9010 being a 3nm chip remains uncertain, raising the possibility of Huawei reusing the name, unless the company has found a solution to navigate around trade restrictions. Huawei had previously registered a trademark for the name in 2021, with initial plans for production in 2022, which did not materialize.
Reports suggest that the P70 series will mark the return of 5G connectivity for Huawei. Notably, there are rumors indicating that the P70 Art model’s ultra-wide camera may boast a 1-inch type sensor and a high-quality 1G6P lens (featuring one glass element and six plastic elements). Additionally, Huawei is reportedly working on developing its own sensors, expected to debut with the P70 series slated for unveiling in March.