Qualcomm has unveiled its latest midrange chipset for mobile devices, the Snapdragon 7 Gen 3. Despite its name suggesting a successor to the SD 7+ Gen 2 or SD 7s Gen 2, this new chip actually fits between the two aforementioned SoCs. Manufactured using TSMC’s 4nm process technology, the SD 7 Gen 3 features a 1+3+4 CPU configuration. The Kryo CPU comprises a prime core clocked at 2.63GHz, accompanied by 3 performance cores at 2.4 GHz and 4 efficiency cores at 1.8GHz.
Qualcomm asserts a 15% improvement in CPU performance and a 50% faster Adreno GPU compared to last year’s Snapdragon 7 Gen 1 chip. The 7 Gen 3 chip is also claimed to deliver a 20% power savings based on Qualcomm’s tests.
The Qualcomm Hexagon NPU embedded in the SD 7 Gen 3 is expected to provide 60% faster AI performance per watt compared to the SD 7 Gen 1. The Adreno GPU supports OpenGL ES 3.2, OpenCL 2.0 FP, and Vulkan 1.3 APIs.
Additionally, the new Qualcomm chip supports up to 4K resolution displays at a 60Hz refresh rate or FHD+ resolution at 168Hz. It features a Qualcomm Spectra ISP capable of handling main camera modules with up to 200MP and recording 4K HDR video at 60Hz.
The SD 7 Gen 3 is paired with the Snapdragon X63 5G Modem-RF System, ensuring download speeds of up to 5 Gbps over mmWave and sub-6 GHz bands. In terms of connectivity, the chip supports Wi-Fi 6E and Bluetooth 5.3 standards.
The first devices featuring the Snapdragon 7 Gen 3 are anticipated to launch later this month, with Honor and vivo named as key OEMs pioneering the implementation of this new chipset.